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Description
• 300W Hot air rework station with automatic cooling system.
• LED digital display, showing current temperature and status.
• MCU confirms fast heat up, accurate and stable control on temperature.
• Temperature range: 100-500°C.
• Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA.
• Includes three nozzles.
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